MAP handlers (4170-IH)

    We, Tesec is now introducing the new Map handler model 4170-IH that is for the direct test of the leadless QFN, CSP devices after dicing on the wafer.As the device tesrting is on the wafer ring, and devices positioning(x y z θ)compensation before testing by the visual check system, the high accuracy of the devices positioning informationand the suitable probe-pin contact pressure are maintained for the stable testing and high speed indexing.This new model is upgraded as a succeeding machine of the previous model 3270-IH that improved the transfer accuracy and increased the widthstand load of the test section table, also able to handle the WLCSP as well as comply to multi-testing site and simultaneous (parallel) testing.

Features

  • High throughput
  • High withstand load, and high thrust table
  • Expansion of the strip attachment area 260(L) X 300(W) [Withinφ300mm for WLCSP]
  • LOT control by barcode/2D code reader
  • Easy device type exchange only test socket and  display screen setting
  • Auto-cleaning function unit is installed to  clean the socket at any desired timing.
  • 8/12 inches ring conversion
  • S2/S8 regulation
  • SEMI G85 compliance
  • SECS/GEM compliance

 

Specification

 Model 4170-IH
 Applicable device QFN, DFN, CSP, BGA, BCC, LLP, WLCSP
 Applicable ring size 8 / 12 inches
 Test station Multi-parallel
Contact method Pogo-pin or specified contactor
Supply ring capacity 1 cassette(Wafer ring 25 pcs/8 inches, 13 pcs/12 inches)
Stock ring capacity 1 cassette(Wafer ring 25 pcs/8 inches, 13 pcs/12 inches)

 

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