Bonding Wire

What is Bonding Wire?

As essential material for semiconductor manufacture that connects lead and silicon chips to transmit eletrical signals. A fine wire that is about 1/4 the thickness of hair and requires high-strength ultra precision technology and a special technology to endure high temperatures for a long time.

Bonding Wire Trends

As semiconductors are becoming lighter , thinner , shorter , and smaller , Si chips are also becoming smaller. Si chips are required to integrate many in/out clusters , the wires used for semiconductor assembly are becoming very fine between 25 Um (0.025mm) and 15 Um(0.015mm.)

With about 1-don of gold(3.75g) , we manufacture about 1,100m of wire (at 15Um).

Bonding Wire Manufacturing Process

 

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